On August 22, at the First Chiplet Integration Technology and Industry Development Forum, the Shenzhen University of Advanced Technology Chiplet Integration Technology Industry Innovation Center (Preparatory) was officially unveiled.The center has 10 laboratories under it, including the Core Software Laboratory, Chiplet Architecture Laboratory, and RISC-V Chiplet Design Standardization Laboratory, hiring relevant industry experts as laboratory directors, gathering forces from government, industry, academia, and research to build an important platform for innovation and industry docking, providing strategic support for the school's discipline construction and industry-academia-research transformation.

As an important path of change in the global semiconductor industry, chiplet integration technology is redefining the boundaries of chip design and manufacturing, driving breakthrough innovations in fields such as artificial intelligence, high-performance computing, and medical health. This forum set up links such askeynote speeches, technology demonstrations, roundtable discussions, and laboratory visits, providing a deep exchange platform for participants. Ten top experts brought keynote reports, covering key areas of the full ecosystem of chiplet integration technology such asNPU simulators, interconnect architectures, lithography technology, RISC-V design, EDA tools, medical applications, packaging processes, and equipment innovation,showcasing a panoramic view from theoretical innovation to industrial application. In addition, undergraduates and postgraduates from the Faculty of Computility Microelectronics at Shenzhen University of Advanced Technology also attended for observation and exchange, broadening students' horizons and inspiring innovation through an open educational model.

Zhu Dijian, Party Secretary of Shenzhen University of Advanced Technology, stated that as a new research-oriented university, Shenzhen University of Advanced Technology shoulders the mission of exploring higher education reform and serving national needs, forming the educational characteristic of"integrating science education and industry-education fusion to run the university, building interdisciplinary majors, and cultivating talents through 'three academies integration'". Through establishing the country's first Faculty of Computility Microelectronics, setting up the Guangdong Provincial Key Laboratory of Computility Microelectronics, and other innovation platforms, focusing on key technology breakthroughs, the university has built a full chain from basic research to industrialized application. “With the unveiling of the Chiplet Integration Technology Industry Innovation Center (Preparatory),Shenzhen University of Advanced Technology will join hands with partners to build a leading domestic R&D and industrialization base, taking a key step in this strategic field.”

Yao Gaoke, Member of the Standing Committee and Executive Deputy District Mayor of Guangming District, stated that as the pioneering launch area for a comprehensive national science center, the deep integration of universities and local development is a significant advantage of Guangming District, and he affirmed the important role Shenzhen University of Advanced Technology plays in the regional innovation ecosystem. He pointed out, "Guangming District will use 'four-chain fusion' as a grip to promote the deep interweaving ofeducation chain, innovation chain, talent chain, and industry chain,fully supporting the construction of the Shenzhen University of Advanced Technology Chiplet Integration Technology Industry Innovation Center (Preparatory),allowing the industry-education integration model to bear fruit here and substantially enhancing the hard power of industrial technological innovation.”

Tang Zhimin, Dean of the Faculty of Computility Microelectronics at Shenzhen University of Advanced Technology, stated that chiplet integration technology can assemble multiple chiplets through advanced packaging to form more cost-effective and demand-fitting technical solutions. "The Chiplet Integration Technology Industry Innovation Center (Preparatory) is precisely to unite industry forces to explore this direction, achieving flexible trading of chiplets through standardized processes." He said, looking forward to this forum becoming a technological milestone,promoting effective integration of technologies from all parties and contributing to innovative breakthroughs in China's semiconductor field.

With the continuous deepening of hardware and software collaborative innovation, chiplet integration is moving from technical concepts to industrial practice, expected to reshape the global chip industry landscape. Shenzhen University of Advanced Technology will continue to build an open innovation ecosystem, co-building a highland for chiplet integration technology with global partners,injecting strong momentum into the high-quality development of the semiconductor industry in the Greater Bay Area and even China.

This Chiplet Integration Technology and Industry Development Forum was hosted by Shenzhen University of Advanced Technology, co-organized by Shenzhen Semiconductor and Integrated Circuit Industry Alliance (SICA), Shenzhen Advanced Technology Collaborative Innovation Association, and Shenzhen Intelligent Manufacturing Industry Promotion Association. Lin Zhenxiang, Director of the Development and Reform Bureau of Guangming District, relevant responsible persons from Shenzhen Major Industry Investment Group, Zhang Jian, Executive Secretary-General of SICA, experts and scholars from institutions such as Empyrean Technology, Tsinghua Unigroup, and Institute of Intelligent Photonics at Nankai University, as well as relevant responsible persons from the Research and Industry Office of Shenzhen University of Advanced Technology, attended the event.